The AMD Ryzen AI 9 HX 475 is designed for both desktop and laptop platforms and features integrated graphics alongside full 64-bit support. Built on a 4nm semiconductor process, it operates with a Thermal Design Power of 28W and can sustain a maximum CPU temperature of 100°C. The processor supports PCIe 4.0 for connectivity with compatible expansion hardware and storage devices.
The processor delivers 24 threads across a hybrid core configuration using big.LITTLE technology, with base clock speeds arranged as 4 cores at 2GHz and 8 cores at 2GHz, scaling up to a turbo clock of 5.2GHz. An unlocked multiplier provides additional headroom for manual frequency adjustments. Cache resources include 12MB of L2 and 24MB of L3, supporting efficient data access across the core complex.
The integrated Radeon 890M runs at a base clock of 400MHz and boosts up to 3100MHz, with support for up to 4 simultaneous displays. Its rendering pipeline consists of 1024 shading units, 64 texture mapping units, and 32 render output units. API compatibility covers DirectX 12, OpenGL 4.6, and OpenCL 2.1, covering a broad range of graphics and compute workloads.
The processor supports DDR5 memory across two channels, with a maximum rated speed of 8533MHz and a ceiling of 256GB total capacity. ECC memory is not supported, making it oriented toward standard consumer and prosumer configurations rather than error-correcting workloads.
The processor includes multithreading support and an NX bit for hardware-level execution protection. Its instruction set coverage spans MMX, SSE 4.1, SSE 4.2, AVX, AVX2, FMA3, F16C, and AES, providing a broad foundation for vectorized operations, floating-point workloads, and hardware-accelerated encryption.