The performance of the G.Skill Flare X5 AMD DDR5-6000 is driven by its 6000 MHz tested memory speed, which is paired with a 30 CAS latency (CL) for responsive operation. It operates with a tRAS of 96, tRCD of 36, and tRP of 36, ensuring stable and efficient memory timings. The module also features a 10 ns true latency, which optimizes access speeds for demanding tasks. Additionally, it is built on the latest DDR5 memory version, providing improved data throughput and performance compared to previous generations.
The G.Skill Flare X5 AMD DDR5-6000 memory kit features a 288-pin DIMM form factor, ensuring compatibility with a wide range of motherboards. It offers a total memory size of 2 x 48GB, providing a substantial 96GB capacity for demanding applications. Each module operates at 1.35V, while the overall height of the modules is 33 mm, making them suitable for most builds. Notably, this kit does not include Samsung B-Die chips, but still delivers solid performance for high-performance computing needs.
The G.Skill Flare X5 AMD DDR5-6000 memory kit is equipped with AMD EXPO support, enabling optimized performance on compatible systems. It features an integrated heatsink for efficient thermal management during high-performance tasks. However, this kit does not include RGB lighting or support for ECC memory, making it a straightforward choice for users who prioritize performance over aesthetics or error-correction capabilities.