Intel Xeon 6740P

Name: Intel Xeon 6740P
Brand: Intel
SKU: 8390

Manufacturer: Intel

The Intel Xeon 6740P is a server-class processor aimed squarely at demanding enterprise workloads that require both high core density and substantial memory bandwidth. Built on a 3 nm semiconductor process, this 48-core chip operates at a base clock of 2.1 GHz across all cores, with Turbo Boost 2 capable of pushing a single core to 3.8 GHz when thermal headroom allows. It carries a rated TDP of 270W and a maximum operating temperature of 91°C, figures that reflect its positioning within high-performance data center environments.

On the memory side, the Xeon 6740P supports DDR5 across eight channels at speeds up to 6400 MHz, with a maximum addressable capacity of 4000GB and ECC support for error-corrected operation. Its cache hierarchy is notably deep, with 5376 KB of L1, 96 MB of L2 at 2 MB per core, and a substantial 288 MB of L3 distributed at 6 MB per core. The processor connects via PCIe 5.0 with a bus transfer rate of 24 GT/s, and supports a wide instruction set including AVX2, AES, FMA3, and SSE 4.2. With 96 threads through multithreading and a PassMark score of 122165, it reflects strong multi-threaded throughput for parallelized enterprise tasks.

Pros

Supports up to 4000GB of DDR5 ECC memory across eight channels, providing substantial capacity and reliability for memory-intensive server workloads
The 288MB L3 cache distributed at 6MB per core helps reduce memory latency for data-heavy parallel tasks
PCIe 5.0 connectivity with a 24 GT/s bus transfer rate enables high-bandwidth communication with compatible peripherals and storage
A broad instruction set including AVX2, AES, and FMA3 covers vectorized computation and hardware-accelerated encryption natively
96 threads across 48 cores allow the processor to handle heavily parallelized workloads without task queuing bottlenecks
Built on a 3nm process, which contributes to the transistor density achievable within the chip's physical footprint

Cons

A 270W TDP places significant demands on cooling infrastructure, requiring robust thermal management in any deployment
No integrated graphics means a discrete GPU or dedicated display adapter is always required, adding dependency on additional hardware
The clock multiplier is locked, removing any possibility of adjusting base frequency for specific workload tuning
A base clock of 2.1 GHz is relatively modest for single-threaded tasks, and the single-core PassMark of 3185 reflects this constraint
The maximum operating temperature of 91°C leaves limited thermal headroom in environments where sustained load is continuous

Who is this for?

The Intel Xeon 6740P is well-matched to enterprise environments that depend on high-core-count parallel processing, such as large-scale data analytics, scientific simulation, or virtualization platforms running many concurrent workloads. Its support for up to 4000GB of DDR5 ECC memory across eight channels makes it particularly appropriate for memory-intensive server deployments where both capacity and data integrity are critical. The inclusion of hardware-accelerated instruction sets like AES and AVX2, combined with a locked and predictable configuration, also suits managed data center infrastructure where stability and workload consistency take precedence over flexibility.

Who is this NOT for?

This processor is not a practical fit for environments where single-threaded responsiveness is the primary concern, as its 2.1 GHz base clock and single-core PassMark of 3185 reflect a design optimized for throughput rather than latency-sensitive tasks. The absence of integrated graphics means it cannot function independently in any context that requires display output, making it unsuitable for general-purpose workstations or desktop deployments without an accompanying discrete GPU. Additionally, its 270W TDP and associated cooling demands make it a poor fit for space-constrained or thermally limited installations where power efficiency is a priority over raw computational density.

General info:

Thermal Design Power (TDP)	270W
semiconductor size	3 nm
PCI Express (PCIe) version	5
Supports 64-bit	✓
CPU temperature	91 °C
Has integrated graphics	✕

The Intel Xeon 6740P carries a Thermal Design Power (TDP) of 270W and a maximum CPU temperature of 91°C, reflecting its demands within thermally managed server environments. It is fabricated on a 3 nm semiconductor process and connects to the platform via PCIe 5.0, enabling high-bandwidth peripheral communication. The processor fully supports 64-bit computing but does not include integrated graphics, making it dependent on a discrete graphics solution for any display output.

Performance:

CPU speed	48 x 2.1 GHz
CPU threads	96 threads
turbo clock speed	3.8GHz
L3 cache	288 MB
L1 cache	5376 KB
L2 cache	96 MB
L2 core	2 MB/core
clock multiplier	21
Has an unlocked multiplier	✕
L3 core	6 MB/core
Turbo Boost version	2

The Intel Xeon 6740P runs 48 cores at a base clock of 2.1 GHz, yielding 96 threads through multithreading, with Turbo Boost 2 allowing individual cores to reach 3.8 GHz under suitable conditions. The clock multiplier is set at 21 and cannot be adjusted, as the processor does not feature an unlocked multiplier. Its cache architecture is particularly deep: L1 stands at 5376 KB, L2 at 96 MB with 2 MB allocated per core, and L3 reaching 288 MB in total at 6 MB per core — a configuration suited to workloads that benefit from keeping large datasets close to the execution units.

Memory:

Supports ECC memory	✓
DDR memory version	5
RAM speed (max)	6400 MHz
maximum memory amount	4000GB
memory channels	8
bus transfer rate	24 GT/s

The Intel Xeon 6740P supports DDR5 memory across eight channels, with a maximum rated speed of 6400 MHz and a bus transfer rate of 24 GT/s, enabling substantial memory bandwidth for throughput-sensitive workloads. It accommodates up to 4000GB of total memory, providing considerable headroom for memory-intensive enterprise applications. ECC memory support is included, allowing the system to detect and correct single-bit errors — an important reliability consideration in server deployments.

Features:

uses multithreading	✓
instruction sets	MMX, F16C, FMA3, AES, AVX, AVX2, SSE 4.1, SSE 4.2
Has NX bit	✓

The Intel Xeon 6740P supports multithreading, allowing each physical core to handle two threads simultaneously for more efficient utilization of execution resources. It implements the NX bit, a hardware-level security feature that helps prevent certain classes of malicious code execution by marking memory regions as non-executable. The processor also supports a broad range of instruction sets — including AVX2, AES, FMA3, F16C, SSE 4.1, SSE 4.2, and MMX — covering vectorized math operations, hardware-accelerated encryption, and extended floating-point capabilities across a wide variety of workload types.

Benchmarks:

PassMark result	122165
PassMark result (single)	3185

In PassMark testing, the Intel Xeon 6740P achieves a multi-threaded score of 122165, reflecting the cumulative throughput delivered by its 48 cores and 96 threads under parallelized workloads. Its single-threaded PassMark result stands at 3185, indicating the level of performance available to tasks that rely primarily on single-core execution speed.

Final Verdict

The Intel Xeon 6740P is a processor built with a clear and deliberate focus: delivering sustained throughput at scale within managed enterprise infrastructure. Its 48-core, 96-thread configuration paired with 288MB of L3 cache and up to 4000GB of DDR5 ECC memory support positions it as a capable foundation for data-intensive server workloads where parallelism and memory reliability are non-negotiable. The trade-offs — a modest base clock, a locked multiplier, no integrated graphics, and a 270W thermal envelope — are consistent with a chip designed for rack-mounted deployments rather than flexible or general-purpose use. For organizations running virtualization, large-scale analytics, or workloads that demand both core density and memory depth, the Xeon 6740P represents a well-defined, purpose-driven solution.