The General info specifications of this processor outline several foundational platform characteristics. It carries a Thermal Design Power (TDP) of 300W and a maximum operating temperature of 98°C, reflecting the thermal envelope expected for enterprise-grade silicon. The chip is fabricated on a 3 nm semiconductor process and connects to the platform via PCIe 5.0, with full 64-bit instruction support included. Integrated graphics are not part of this configuration.
This processor comprises 48 cores running at a base clock speed of 2.4 GHz, yielding 96 threads in total through multithreading. It supports Turbo Boost version 2, allowing frequencies to reach up to 4.9 GHz under boost conditions. The clock multiplier is set to 24 and is unlocked, providing flexibility in clock configuration. Cache resources amount to 192 MB of L3 cache in total, distributed at 4 MB per core across the full core count.
This processor uses DDR5 memory and supports up to eight memory channels, allowing for broad memory bandwidth across demanding workloads. RAM speeds can reach a maximum of 6400 MHz, and the total addressable memory capacity tops out at 4000GB. ECC memory support is included, enabling error-correcting functionality suited to server and enterprise environments where data integrity is a priority.
This processor supports multithreading, allowing each physical core to handle two threads simultaneously for improved throughput across parallel tasks. The chip includes NX bit support, which enables hardware-level memory protection against certain classes of malicious code execution. On the instruction set side, the processor covers a broad range including MMX, AVX, AVX2, FMA3, F16C, AES, SSE 4.1, and SSE 4.2, catering to workloads that rely on vectorized arithmetic, encryption acceleration, and extended floating-point operations.