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Intel Xeon 6966P-C specifications and in-depth review

Intel Xeon 6966P-C

Manufacturer: Intel

The Intel Xeon 6966P-C is an enterprise-grade processor designed for demanding workloads. With its robust architecture, it features a 550W thermal design power (TDP) and offers impressive multi-threading capabilities with 96 threads.

Key specifications include a base clock speed of 3.1 GHz, with a turbo boost reaching 3.9 GHz, and a substantial L3 cache of 432 MB. It supports DDR5 memory, a maximum memory size of 3000GB, and features 12 memory channels for enhanced bandwidth and performance.

Pros
  • Supports multithreading, enhancing performance in parallel tasks.
  • Equipped with 12 memory channels, providing high bandwidth for demanding applications.
  • Supports ECC memory for improved system reliability and error correction.
Cons
  • Does not include integrated graphics, requiring a separate GPU for visual tasks.
  • Has a relatively high thermal design power (TDP) of 550W, which may require substantial cooling solutions.
  • Clock multiplier is locked, limiting overclocking potential.
Who is this for?

The Intel Xeon 6966P-C is ideal for high-performance enterprise environments where large-scale data processing, multitasking, and system stability are critical. With support for ECC memory and 12 memory channels, it is well-suited for mission-critical applications that require error correction and high throughput. Its ability to handle up to 3000GB of memory makes it a strong fit for data centers and server farms running resource-intensive workloads.

Who is this NOT for?

This processor is not suited for environments where space, energy efficiency, or integrated graphics are important. With a 550W TDP, it demands substantial cooling and power infrastructure, making it less ideal for compact or energy-constrained setups. Additionally, the lack of integrated graphics means it requires a dedicated GPU, which could add complexity for users looking for an all-in-one solution.

General info:

Thermal Design Power (TDP) 550W
release date May 2025
semiconductor size 3 nm
PCI Express (PCIe) version 5
Supports 64-bit ✓
CPU temperature 96 °C
Has integrated graphics ✕

The Intel Xeon 6966P-C is built with a 3 nm semiconductor size and has a thermal design power (TDP) of 550W, making it suitable for high-performance applications. It supports PCIe 5.0 and 64-bit processing, ensuring compatibility with the latest technologies. The processor operates at a maximum CPU temperature of 96°C and does not include integrated graphics.

Performance:

CPU speed 96 x 3.1 GHz
CPU threads 192 threads
turbo clock speed 3.9GHz
L3 cache 432 MB
clock multiplier 31
Has an unlocked multiplier ✕
L3 core 4.5 MB/core
Turbo Boost version 2

The Intel Xeon 6966P-C features a total clock speed of 96 x 3.1 GHz and 192 threads, enabling efficient multitasking and high-performance computing. It also offers a turbo clock speed of 3.9 GHz and a large L3 cache of 432 MB, with 4.5 MB per core. The processor is equipped with a clock multiplier of 31, but does not support an unlocked multiplier.

Memory:

Supports ECC memory ✓
DDR memory version 5
RAM speed (max) 8800 MHz
maximum memory amount 3000GB
memory channels 12

The Intel Xeon 6966P-C supports ECC memory for error correction, providing enhanced stability for mission-critical applications. It is compatible with DDR5 memory, offering a maximum RAM speed of 8800 MHz. The processor can handle up to 3000GB of memory across 12 memory channels, ensuring ample bandwidth and scalability for demanding workloads.

Features:

uses multithreading ✓
instruction sets MMX, F16C, FMA3, AES, AVX, AVX2, SSE 4.1, SSE 4.2
Has NX bit ✓

The Intel Xeon 6966P-C utilizes multithreading to enhance processing efficiency across multiple tasks. It supports a wide range of instruction sets including MMX, FMA3, AES, AVX, and SSE 4.2, making it versatile for various computational needs. Additionally, the processor includes the NX bit for added security against certain types of attacks.

Benchmarks:

Final Verdict

The Intel Xeon 6966P-C is a high-performance enterprise CPU designed for demanding workloads and large-scale data processing. With its impressive ECC memory support and robust memory capabilities, it excels in environments where reliability and large memory bandwidth are crucial. While its high thermal design power (TDP) and lack of integrated graphics may limit its use in compact or energy-efficient setups, it remains a strong choice for data centers, servers, and other enterprise-level applications that require raw processing power and stability.

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