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KingBank DDR5-6000 CL30 32GB (2x16GB) specifications and in-depth review

KingBank DDR5-6000 CL30 32GB (2x16GB)

Manufacturer: KingBank

The KingBank DDR5-6000 CL30 is a 32GB dual-channel desktop memory kit consisting of two 16GB modules in a standard 288-pin DIMM form factor. Designed for DDR5 platforms, it operates at a tested speed of 6000 MHz while defaulting to 4800 MHz at the SPD level, giving users flexibility depending on their motherboard configuration. The kit runs without RGB lighting and keeps a low profile at 38 mm tall, though it does include an integrated heatsink for thermal management.

On the timing side, the kit is rated at CL30-36-36-76, with a true latency of 10 ns at its rated speed and a operating voltage of 1.35V. It supports Intel XMP 3.0 for straightforward frequency enabling on compatible platforms, though AMD EXPO is not listed among its supported profiles. The kit does not use Samsung B-Die ICs and does not support ECC memory, placing it squarely in the mainstream consumer segment for standard desktop use.

Pros
  • Runs at a tested speed of 6000 MHz with CL30 timings, yielding a true latency of just 10 ns
  • Intel XMP 3.0 support allows straightforward frequency enabling on compatible motherboards
  • Integrated heatsink helps manage module temperatures during operation
  • Low-profile height of 38 mm reduces the risk of clearance conflicts with large CPU coolers
  • No RGB lighting keeps the build clean and avoids unnecessary power draw from aesthetics
  • Ships as a matched dual-channel kit totaling 32GB, suitable for memory-intensive workloads
Cons
  • AMD EXPO is not supported, limiting plug-and-play overclocking options on AMD platforms
  • Does not use Samsung B-Die ICs, which some users specifically seek for manual overclocking headroom
  • ECC memory is not supported, ruling it out for error-sensitive or workstation applications
  • SPD default is 4800 MHz, so XMP must be manually enabled to reach the rated 6000 MHz speed
Who is this for?

This kit is well-suited for desktop users building or upgrading an Intel DDR5 platform, particularly those looking to take advantage of Intel XMP 3.0 to reach 6000 MHz without manual tuning. Its 32GB total capacity across two matched modules makes it a reasonable fit for memory-intensive workloads such as content creation, video editing, or heavy multitasking. The integrated heatsink and compact 38 mm height also make it a practical choice for builds where cooling clearance is a concern but aesthetic lighting is not a priority.

Who is this NOT for?

Users building on an AMD platform will find this kit limiting, as it lacks AMD EXPO support, meaning automatic frequency enabling at 6000 MHz is not guaranteed on those systems. It is also unsuitable for workstation or server environments that require ECC memory for error correction and data integrity. Additionally, enthusiasts who prioritize manual overclocking headroom and specifically seek Samsung B-Die ICs will need to look elsewhere, as this kit does not use that memory IC.

Performance:

true latency 10 ns
memory speed (Tested Speed) 6000
memory speed (SPD) 4800 MHz
DDR memory version 5
CAS Latency (CL) 30
tRAS timing 76
tRCD timing 36
tRP timing 36

This kit operates as DDR5 memory with a tested speed of 6000 MHz, though its SPD default sits at 4800 MHz for out-of-the-box compatibility. The primary timings are set at CL30-36-36-76, covering CAS Latency, tRCD, tRP, and tRAS respectively, which translates to a true latency of 10 ns at the rated frequency.

General info:

form factor 288-pin DIMM
memory size (total) 2 x 16GB
has Samsung B-Die ✕
voltage 1.35V
height 38 mm
memory size 16GB

The kit comes in a 288-pin DIMM form factor and consists of two 16GB modules for a total of 32GB. Each module operates at 1.35V and stands 38 mm tall, making it reasonably compact for a heatsink-equipped design. The ICs are not Samsung B-Die.

Features:

Intel XMP / AMD EXPO Intel XMP 3.0
Supports ECC memory ✕
Has an integrated heatsink ✓
has RGB lighting ✕

The kit supports Intel XMP 3.0 for straightforward frequency configuration on compatible platforms, while AMD EXPO is not included among its profiles. It comes with an integrated heatsink for thermal management but lacks RGB lighting, giving it a clean, understated appearance. ECC memory is not supported.

Benchmarks:

Final Verdict

The KingBank DDR5-6000 CL30 32GB kit is a straightforward, no-frills DDR5 option for Intel platform builds, delivering a genuine 6000 MHz operating speed with a true latency of 10 ns and reliable Intel XMP 3.0 support for hassle-free setup. Its 32GB dual-channel configuration and integrated heatsink make it a practical choice for users who need meaningful capacity and thermal coverage without the added bulk of RGB lighting. That said, its lack of AMD EXPO support and ECC capability do define the boundaries of its target audience fairly clearly. For Intel DDR5 users who want a capable, clean-looking memory kit without unnecessary extras, the KingBank DDR5-6000 CL30 delivers what it promises within its intended scope.

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