KingBank DDR5-6000 CL36 16GB (2x8GB) specifications and in-depth review

KingBank DDR5-6000 CL36 16GB (2x8GB)

Manufacturer: KingBank

The KingBank DDR5-6000 CL36 is a 16GB dual-channel memory kit consisting of two 8GB modules in a standard 288-pin DIMM form factor. Designed for DDR5 platforms, it targets users who want a balance between capacity and clock speed, operating at a tested speed of 6000 MHz with a true latency of 12 ns at 1.35V. The kit includes an integrated heatsink while keeping a low-profile height of 38 mm, and it does not feature RGB lighting.

On the technical side, the kit runs with CL36-36-36-80 timings (CL, tRCD, tRP, tRAS respectively), and its SPD base speed is 4800 MHz. Overclocked profiles are available through both Intel XMP 3.0 and AMD EXPO, allowing compatible motherboards to load the 6000 MHz configuration automatically. The modules do not use Samsung B-Die and do not support ECC functionality.

Pros
  • Supports both Intel XMP 3.0 and AMD EXPO profiles, making it compatible with a wide range of modern platforms without manual tuning
  • Tested speed of 6000 MHz with a true latency of 12 ns reflects a well-balanced timing configuration for DDR5
  • Integrated heatsink helps with thermal management during operation
  • Low module height of 38 mm reduces the chance of clearance conflicts with CPU coolers
  • No RGB lighting keeps the build clean and avoids potential software dependencies
Cons
  • Each module is only 8GB, which may be limiting for memory-intensive workloads that benefit from higher per-slot capacity
  • Does not support ECC memory, ruling it out for use cases that require error-correcting functionality
  • SPD base speed of 4800 MHz means full 6000 MHz performance depends entirely on XMP or EXPO being enabled in the BIOS
  • Does not use Samsung B-Die, which some users specifically seek out for overclocking headroom beyond rated speeds
Who is this for?

This kit is well-suited for users building or upgrading a modern desktop system on either an Intel or AMD platform, thanks to its support for both Intel XMP 3.0 and AMD EXPO profiles. The 6000 MHz tested speed with tight-for-DDR5 CL36 timings makes it a reasonable choice for everyday computing, gaming, and general productivity workloads where memory bandwidth matters. Its low 38 mm height also makes it practical for builds using large tower coolers where module clearance can be a concern.

Who is this NOT for?

This kit is not a good fit for workstation or server environments that require ECC memory support, as error-correcting functionality is absent. Users who need large memory capacity for tasks such as video editing, 3D rendering, or heavy virtualization may find the 8GB-per-module configuration restrictive. It is also unsuitable for enthusiasts who specifically target Samsung B-Die chips for pushing memory overclocks well beyond rated speeds, as these modules do not use that IC.

Performance:

true latency 12 ns
memory speed (Tested Speed) 6000
memory speed (SPD) 4800 MHz
DDR memory version 5
CAS Latency (CL) 36
tRAS timing 80
tRCD timing 36
tRP timing 36

This DDR5 kit operates at a tested speed of 6000 MHz, with a native SPD speed of 4800 MHz. The timings are set at CL36-36-36-80 (CAS Latency, tRCD, tRP, and tRAS respectively), which translates to a true latency of 12 ns at the rated frequency. These figures reflect the kit's actual XMP or EXPO profile behavior when enabled on a compatible platform.

General info:

form factor 288-pin DIMM
memory size (total) 2 x 8GB
has Samsung B-Die
voltage 1.35V
height 38 mm
memory size 8GB

The kit comes in a standard 288-pin DIMM form factor and consists of two 8GB modules for a total of 16GB. It operates at a voltage of 1.35V and measures 38 mm in height. The modules do not use Samsung B-Die integrated circuits.

Features:

Intel XMP / AMD EXPO Intel XMP 3.0, AMD EXPO
Supports ECC memory
Has an integrated heatsink
has RGB lighting

The kit supports both Intel XMP 3.0 and AMD EXPO profiles, allowing compatible motherboards to automatically load the rated frequency and timings. An integrated heatsink is included for thermal management, while RGB lighting is absent, keeping the aesthetic understated. The modules do not support ECC memory.

Benchmarks:

Final Verdict

The KingBank DDR5-6000 CL36 16GB (2x8GB) is a straightforward DDR5 kit that delivers on its core promise: a 6000 MHz tested speed with a CL36-36-36-80 timing configuration and broad platform compatibility through both Intel XMP 3.0 and AMD EXPO support. Its integrated heatsink and compact 38 mm height add practical value for a range of desktop builds. While it is not designed for ECC workloads, extreme overclocking pursuits, or high-capacity memory configurations, it covers the needs of mainstream desktop users on modern Intel and AMD platforms without unnecessary extras. For those seeking a no-frills DDR5 upgrade with solid rated specifications and wide motherboard compatibility, this kit represents a clear and well-defined option.

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