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Klevv Fit V DDR5-6000 CL30 32GB (2x16GB) specifications and in-depth review

Klevv Fit V DDR5-6000 CL30 32GB (2x16GB)

Manufacturer: Klevv

The Klevv Fit V DDR5-6000 CL30 is a 32GB dual-channel desktop memory kit consisting of two 16GB modules in a standard 288-pin DIMM form factor. Designed for systems that prioritize a compact build clearance, it features a slim integrated heatsink standing just 33 mm tall, making it well-suited for tighter cases or configurations with large CPU coolers. The kit operates at DDR5-6000 with a voltage of 1.35V and does not include RGB lighting, keeping the aesthetic understated.

On the timing side, the Klevv Fit V carries a CL30-36-36-76 timing profile at its rated 6000 MHz speed, which translates to a true latency of 10 ns. The base SPD speed is set at 5600 MHz, with the full 6000 MHz profile activated through Intel XMP 3.0 or AMD EXPO on compatible platforms. The kit does not use Samsung B-Die and does not support ECC memory.

Pros
  • Supports both Intel XMP 3.0 and AMD EXPO, making it compatible with a wide range of modern motherboards from either platform
  • The 33 mm module height keeps the kit low-profile, reducing the risk of clearance conflicts with large CPU coolers
  • Runs at a tested speed of 6000 MHz with a true latency of 10 ns, reflecting a well-tuned CL30 timing profile for a DDR5-6000 kit
  • Includes an integrated heatsink to assist with thermal management during operation
  • No RGB lighting means less power draw from the modules and a cleaner aesthetic for builds that do not require it
Cons
  • Does not use Samsung B-Die, which some users specifically seek out for manual overclocking headroom
  • ECC memory is not supported, ruling out use in workloads or platforms that require error-correcting memory
  • The SPD speed of 5600 MHz means the full 6000 MHz profile requires XMP or EXPO to be manually enabled in the BIOS
Who is this for?

This kit works well for desktop builders who want a DDR5-6000 dual-channel setup with broad platform flexibility, since the inclusion of both Intel XMP 3.0 and AMD EXPO means it can be configured on a wide range of modern systems without compatibility concerns. The low 33 mm module height makes it a practical choice for compact or mid-tower builds where CPU cooler clearance is a genuine concern, and users who prefer a clean, understated system aesthetic will appreciate the absence of RGB lighting.

Who is this NOT for?

This kit is not a good fit for users who require ECC memory support, such as those running workstation or server workloads where data integrity validation is essential. Enthusiasts focused on deep manual overclocking may also find it limiting, as the modules do not use Samsung B-Die, which is often favored for pushing memory beyond rated specifications. Additionally, it is entirely unsuitable for laptop or small form factor systems that require SO-DIMM modules, given its 288-pin DIMM form factor.

Performance:

true latency 10 ns
memory speed (Tested Speed) 6000
memory speed (SPD) 5600 MHz
DDR memory version 5
CAS Latency (CL) 30
tRAS timing 76
tRCD timing 36
tRP timing 36

This kit operates on DDR5 and reaches a tested speed of 6000 MHz, while its base SPD speed sits at 5600 MHz for out-of-the-box compatibility on supported platforms. The primary timing profile runs at CL30-36-36-76, covering CAS Latency, tRCD, tRP, and tRAS respectively, which translates to a true latency of 10 ns at the rated speed.

General info:

form factor 288-pin DIMM
memory size (total) 2 x 16GB
has Samsung B-Die ✕
voltage 1.35V
height 33 mm
memory size 16GB

The kit uses the standard 288-pin DIMM form factor and comes as a dual-module configuration totaling 32GB, with each module providing 16GB of capacity. It operates at 1.35V and stands just 33 mm tall, keeping the physical footprint compact. The modules do not use Samsung B-Die.

Features:

Intel XMP / AMD EXPO Intel XMP 3.0, AMD EXPO
Supports ECC memory ✕
Has an integrated heatsink ✓
has RGB lighting ✕

The kit supports both Intel XMP 3.0 and AMD EXPO, allowing the rated speed profile to be enabled on compatible motherboards from either platform. An integrated heatsink is included to help manage heat during operation. The modules do not feature RGB lighting, and ECC memory is not supported.

Benchmarks:

Final Verdict

The Klevv Fit V DDR5-6000 CL30 32GB strikes a sensible balance between performance and practicality for mainstream DDR5 desktop builds. Its 6000 MHz rated speed with a CL30-36-36-76 timing profile delivers a well-tuned latency result of 10 ns, and the dual-platform support via Intel XMP 3.0 and AMD EXPO makes it a flexible choice across current-generation systems. The low 33 mm heatsink profile adds genuine build compatibility without any RGB overhead. It does carry some limitations — no ECC support and the absence of Samsung B-Die will steer away niche users with specific requirements — but for the broader audience of desktop builders seeking a clean, capable DDR5 kit with solid out-of-the-box platform compatibility, the Klevv Fit V makes a coherent and well-rounded option.