Silicon Power DDR4-3200 16GB (1x16GB) specifications and in-depth review

Silicon Power DDR4-3200 16GB (1x16GB)

Manufacturer: Silicon Power

The Silicon Power DDR4-3200 16GB (1x16GB) is a high-performance memory module designed for laptops and compact systems. With a sleek 260-pin SO-DIMM form factor, this module offers 16GB of total memory size for smooth multitasking and gaming experiences. It also comes equipped with an integrated heatsink to manage temperatures during extended use.

This memory module operates at a tested speed of 3200 MHz, with a standard SPD speed of 2666 MHz. It features a CAS Latency (CL) of 22 and utilizes a voltage of 1.2V. The DDR4 version ensures faster data transfer rates while maintaining low power consumption, making it an efficient option for a variety of uses.

Pros
  • Supports Intel XMP 2.0 for easy memory overclocking and optimization.
  • Equipped with an integrated heatsink for improved heat management during extended use.
  • Compact 260-pin SO-DIMM form factor makes it suitable for laptops and small systems.
Cons
  • Does not support ECC memory, limiting its use in error-sensitive applications.
  • Lacks RGB lighting, which may be a downside for users seeking customizable aesthetics.
  • Does not feature Samsung B-Die memory, which is preferred by some for overclocking.
Who is this for?

The Silicon Power DDR4-3200 16GB module is ideal for users looking to upgrade their laptop or compact system with reliable and efficient memory. Its 16GB total memory and Intel XMP 2.0 support make it well-suited for multitasking and gaming, where quick data access and overclocking capabilities are beneficial. Its 260-pin SO-DIMM form factor is perfect for systems with limited space, offering a balance between performance and size.

Who is this NOT for?

This module may not be ideal for users requiring high levels of memory error correction, as it does not support ECC memory, making it unsuitable for workstations or servers where data integrity is critical. Additionally, the lack of RGB lighting may be a downside for users who prefer aesthetic customization in their builds. Users also seeking advanced overclocking features may be limited by the absence of Samsung B-Die memory.

Performance:

true latency 13.75 ns
memory speed (Tested Speed) 3200
memory speed (SPD) 2666 MHz
DDR memory version 4
CAS Latency (CL) 22
tRAS timing 42
tRCD timing 22
tRP timing 22

The Silicon Power DDR4-3200 16GB module offers strong performance with a tested memory speed of 3200 MHz, though it operates at an SPD speed of 2666 MHz. The module features a CAS Latency (CL) of 22, and its timings include tRAS of 42, tRCD of 22, and tRP of 22, ensuring stable and efficient memory operations for various applications. The DDR4 version provides improved performance while maintaining lower power consumption.

General info:

form factor 260-pin SO-DIMM
memory size (total) 1 x 16GB
has Samsung B-Die
voltage 1.2V
height 30 mm
release date February 2025
memory size 16GB

The Silicon Power DDR4-3200 16GB module comes in a compact 260-pin SO-DIMM form factor, making it suitable for laptops and small form-factor systems. It offers a total memory size of 16GB in a single module configuration, with a voltage of 1.2V. The module has a height of 30 mm, ensuring compatibility with systems that require low-profile memory, and it does not feature the Samsung B-Die memory chips.

Features:

Intel XMP / AMD EXPO Intel XMP 2.0
Supports ECC memory
Has an integrated heatsink
has RGB lighting

The Silicon Power DDR4-3200 16GB module supports Intel XMP 2.0 for easy overclocking and fine-tuning of memory settings. It comes equipped with an integrated heatsink to manage temperatures during high-demand usage, though it does not feature RGB lighting or support ECC memory.

Benchmarks:

Final Verdict

The Silicon Power DDR4-3200 16GB module offers a solid upgrade for compact systems, providing 16GB of memory and reliable performance with Intel XMP 2.0 support for overclocking. Its integrated heatsink ensures efficient cooling, making it a good fit for demanding applications in space-constrained environments. While it lacks support for ECC memory and RGB lighting, it delivers dependable performance for users focused on functionality rather than aesthetics. This module is a suitable choice for everyday multitasking, gaming, and general computing needs in small form-factor devices.